Description

                 Basic Specs:

Thermal Conductivity:       >7.5W/mK

Viscosity:                              870 poise

Density:                                2.5g/cm³

Net weight:                          4g

FEATURES/BENEFITS

• Easy to use Syringe.
• Excellent Low thermal resistance.
• High Thermal Conductivity. Exceptional Heat dissipation.
• No lead or other harmful heavy metal.
• Will no irritate skin.
• Odorless.
• Will not dry out, harden or melt.
• High Performance Thermal Compound.
• Efficient Thermal Coupler.
• Absolute Stability.
• Very stable at elevated temperatures.
• No bleed.
• Durable.
• Safe.
• User Friendly.
• Low thermal resistance.
• Well designed.

TYPICAL APPLICATIONS

• Refrigeration and Cooling.
• Heating.
• CPU’s
• GPU
• VGA Cards.
• Power semiconductor components.
• Heat Sinks.
• Water Cooling Solutions.
• Automotive.
• Environmental Solutions.
• General.
• Laboratory.